Job Title: Applications Engineer (应用开发工程师)
Organization: Center Engineering Organization, China Applications Development Center (ADC)
Work Location: Shanghai (上海)
Job Description
• A system level design engineer position which deals with future state of the art technology
• Responsible for the full design cycle - circuit design/simulation, FPGA/DSP design, signal processing, programming, system level debug and correlation
• Design highly sophisticated System-On-Chip measurement systems for world-wide customers (similar to Embedded System Design)
• Develop FPGA/DSP based integrated systems
• Typical project takes 6 to 9 months to complete
• Travel abroad to personally install the hardware and software system solutions on-site
• Work with overseas experts on a daily basis
Requirements
Bachelor's or Master’s degree in Electrical Engineering or similar areas
Knowledge of Digital Signal Processing is desirable
FPGA/DSP Design experience is a plus
Experience in analysis and debug of digital/analog circuits
Unix/C/C++ or Windows/VB programming experience
Excellent interpersonal and teamwork skills.
Strong problem solving skills
Superb spoken and written English communication skills
Adaptability/Flexibility in foreign cultures
Job Title: Software Engineer (软件设计工程师)
Organization: Center Engineering Organization, China Applications Development Center (ADC)
Work Location: Shanghai (上海)
Job Description
Program under Unix/Linux or Windows
Design plugin for Automatic Test Equipment with C, C++ or .NET platform
Develop ATE platform to platform converters with C# , VB.net, Java or Perl
Responsible for the full cycle of software development – investigation tasks, initial design, development, bug fixing, quality engineering, documentation, and maintenance
Requirements
Bachelor's or Master's degree in Computer Science or Software Engineering
Experienced in Compiling Fundamentals and Object-Oriented Programming
Have a good understanding of Software Engineering theories and methodologies
Familiar with C#, Java, C++ or VB.Net programming languages
Familiar with Microsoft Windows, Sun Solaris Unix or Linux system
Excellent spoken and written English
Strong self-motivation
Good communication and interpersonal skills
Job Title: Hardware Design Engineer (硬件研发工程师)
Organization: Global Hardware Business Unit, China Hardware Design Center (HDC)
Work Location: Shanghai (上海)
Role Summary/Purpose
Hardware design engineer will closely work with worldwide engineers to perform engineering works for hardware testing solution of next generation semiconductor devices. The work includes requirement analysis, feasibility study, task planning, project management, design execution, quality control and verification. We are working on cutting edge requirement and future technology, work here can be challenging and exciting.
Job Description
Design semiconductor test hardware solutions of next generation semiconductor devices for world-wide customers
Provide global hardware design support and consulting
Give global hardware infrastructure support and consulting
Deliver hardware design training and seminars to customers
Do hardware project management
Keep close communication with worldwide Teradyne teams and customers
Requirements
Master’s or Bachelor's degree in Electronic Engineering, Micro-Electronics, Mechatronics, Communication Engineering, Automation, Instrumentation and Measurement, Biomedical engineering or similar major related to circuit design or hardware engineering
Good knowledge and understanding of electronic circuit theory and application
Knowledge and experience in multi-layer board design and embedded system design
Good communication skills, good written and oral English
Meticulous,pay attention to details
Ability to effectively solve problems, open minded
Ability to successfully work in a team, cross-functional environment
Ability to travel oversea for extended period of time
Knowledge/Experience in the following areas is a plus
Circuitry design and debug, FPGA design and programming/debugging(VHDL, Verilog)
Experience in one or more EDA tools, such as Cadence, OrCAD, Protel, PADS or Mentor Graphics
High-speed design or RF circuitry design
Mechanical design, familiar with one or more CAD tool, like Solid works, AutoCAD
Simulation tools and application, such as Siwave, HFSS, Sigrity
One or more programming/script language(C, VB, Perl, Python)
Japanese or Korean language skill
我们欢迎2016电子工程或相关专业(电子科学与技术、电子信息工程、通信、自动化、仪器与测量、生物医学工程, 微电子、机械电子等)应届毕业生同学投递简历,一经录用公司将提供有竞争力的薪酬福利待遇。请投递简历至: hr.recruiting.shanghai@teradyne.com
备注:投递简历时,请在邮件的主题里注明:毕业学校+应聘职位
来源:
http://www.job.sjtu.edu.cn/eweb/jygl/zpfw.so?modcode=jygl_scfwzpxx&subsyscode=zpfw&type=viewZpxx&id=MQMzGHeoY6y44RusAiGUvC
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